Intel Stratix 10 FPGA and SoC FPGA are powerful chips designed for high-performance computing, data processing, and acceleration of complex algorithms. These chips are designed using Intel’s advanced 14 nm Tri-Gate process technology, which enables them to achieve higher performance while consuming less power than previous generations.
Overview
The Intel Stratix 10 FPGA and SoC FPGA are designed to deliver high-performance computing capabilities and enable designers to implement complex algorithms and systems. One of the key features of the Intel Stratix 10 FPGA and SoC FPGA is their ability to support high-bandwidth interfaces, such as PCIe Gen3 and Gen4, and high-speed transceivers that can operate at up to 58 Gbps. These features make the chips ideal for networking, data centers, and high-performance computing applications.
The Intel Stratix 10 FPGA and SoC FPGA support HBM2 (High Bandwidth Memory 2) stacks, providing up to 512 GB/s of memory bandwidth. The SoC FPGA allows designers to implement memory-intensive applications and algorithms with ease. The Intel Stratix 10 FPGA and SoC FPGA also include several security features, such as secure boot, secure device management, and physical design security. These features help ensure the security of the device and the data it processes.
There are a comprehensive set of software tools and libraries, including the Quartus Prime development software, the OpenCL programming language, and the Intel FPGA SDK for OpenCL also supports the Intel Stratix 10 FPGA and SoC FPGA. These tools enable designers to develop and optimize their algorithms and systems quickly and efficiently.
Overall, the Intel Stratix 10 FPGA and SoC FPGA are powerful chips that offer high-performance computing capabilities, high-speed interfaces, and advanced security features. These chips are well-suited for various applications, from data processing and networking to high-performance computing and machine learning.
Intel Stratix 10 FPGA and SoC FPGA Specification
- Intel’s Stratix 10 SoC & FPGA compatibility with F1760 Package
- 32GB eMMC Flash (Upgradable) and 1Gb QSPI Flash (Upgradable)
- 8GB DDR4 for HPS with ECC (64bit + 8bit) (Upgradable)
- 2 x 8GB DDR4 for FPGA (64bit + 64bit) (Upgradable)
- Upto 16 GXT Transceiver Channels up to 28.3Gbps
- 24 GX/GXT Transceiver Channels up to 28.3Gbps
- Gigabit Ethernet PHY for HPS and USB2.0 OTG Transceiver for HPS
- More than 100 LVDS IOs are available through B2B Connectors.
- Power Input 5V through B2B Connector
- Operating Temperature -40°C to +85°C
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